Interconnection length distributions in 3-dimensional anisotropic systems

In recent years we have witnessed the arrival of the technology necessary for building 3-dimensional electronic systems 1]. These systems could consist of a number of 2-dimensional electronic boards, stacked on top of each other. A large number of vertical interconnections, distributed over the surface of the boards, interconnect adjacent electronic planes. The primary alleged advantage of such systems over conventional 2-dimensional ones is the reduction of signal latency due to reduced interconnec-tion lengths. This paper is concerned with model-ing 3-dimensionalelectronic systems, and estimating layout properties like interconnection length distributions .